Design, validate, and productize high-speed copper and optical connectivity solutions for AI clusters (100k+ GPU scale). - Own vendor due diligence and onboarding for new 1.6T products including AEC and pluggable optical transceivers (DR4/8, FR4) including rigorous bring-up & characterization. - Investigate the opportunity for LPO and LRO in our network. - Evaluate early co-packaged and near-packaged engines for switches and GPUs. - Pathfinding for new interconnect modalities including VCSEL, microLED, THz radio-based solutions to improve network economics and reliability. - Work closely with vendors (transceiver, cable, SerDes, DSP, silicon photonics foundries) to influence roadmaps and ensure timely delivery of next-gen solutions. - Collaborate with ML training teams to translate workload communication patterns into concrete interconnect topology and optical reconfigurability requirements. - Perform system-level simulation of end-to-end fabric performance. - Drive failure analysis, root cause, and corrective actions for interconnect-related issues in production clusters through fleet-level metrics gathering and analysis. - Contribute to internal tooling and automation for interconnect health monitoring, telemetry, diagnostics, remediation and automated qualification pipelines. - Stay current with industry standards (OIF CMIS, IEEE) and emerging technologies (multi-core/hollow-core fiber, 448G SerDes, TFLN, ring resonators)
BASIC QUALIFICATIONS:
At least 8+ years of hands-on experience in designing, deploying and operating high-speed copper and optical interconnects, preferably in a module design role or in a hyperscale datacenter environment. - Master's or PhD degree in Electrical Engineering, Photonics or Physics. - Deep knowledge of PAM4 SerDes performance, equalization, jitter, crosstalk. - Solid operational understanding of FEC, Retimers, TIAs and Drivers. - Deep knowledge of optical link budget analysis and performance metrics including TDECQ, OMA, Tcode, stressed receiver sensitivity and associated diagnostics. - Expertise in transceiver components including CW lasers, SiPh PICs, EML, DSP, passive subassemblies, their failure modes and characterization. - Knowledge of thermal, mechanical, power, signal integrity constraints in dense hardware. - Knowledge of SiPh design process, yield improvement and reliability testing. - Familiarity with CPO technologies and challenges/risk areas. - Familiarity with subcomponent supply chains and global manufacturers, ODMs and CMs. - Strong problem-solving skills and ability to thrive in a fast-paced, ambiguous setting. ### COMPENSATION AND BENEFITS:
$180,000 - $440,000 USD
Base salary is just one part of our total rewards package at X, which also includes equity, comprehensive medical, vision, and dental coverage, access to a 401(k) retirement plan, short & long-term disability insurance, life insurance, and various other discounts and perks. For details on data processing, view our**Recruitment Privacy Notice.*
